Radio Frequency (RF)
& Communications  

RF engineering from circuit to package

Develop communications and RF hardware with NFR's support in circuit design, packaging, and measurement. We help teams address output power, efficiency, bandwidth, and linearity while considering how the board, interconnects, and package affect performance.

Our work spans wireless, wired, optical, and radar applications, with engineering support tailored to the function your system needs.

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Jerry Lopez Working on RF device
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Packaging is part of RF performance

RF development extends beyond the circuit. Board layout, substrate selection, interconnects, and package design all contribute to how a solution performs.

NFR combines circuit design with PCB and substrate capabilities, RF structure fabrication, and advanced assembly services to support compact, integrated hardware.

Measurement to guide development

NFR supports bring-up, characterization, and verification to help evaluate hardware against project requirements.

We work with your team to establish the appropriate test scope, operating conditions, and technical milestones for your design.

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LET’S WORK TOGETHER

Let’s solve your RF and Communications challenge

Whether you’re exploring a custom IC, integrating a board-level system, or developing a packaging approach, share your application, operating frequency range, performance goals, and integration needs. NFR will help identify the right combination of design, prototyping, manufacturing, packaging, and test support—and define the next steps for your project.

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Frequently Asked Questions
RF & Communications

What RF and communications engineering services does NFR provide?

NFR provides custom IC design, board-level integration, PCB and substrate services, advanced packaging, and bring-up and characterization support. Its expertise spans analog, RF/microwave, and mixed-signal engineering. Services are scoped around your application, performance targets, and integration requirements.

Can NFR help determine whether my RF design needs a custom IC?

Yes. NFR begins by reviewing your system requirements and evaluating whether an existing solution or a custom IC is appropriate. Board-level development can help demonstrate functionality before moving toward chip integration.

Can NFR support an existing RF design?

NFR can engage at different stages of development, including system architecture, schematic design, board-level implementation, and ASIC integration. Share your existing design, technical challenges, and desired outcomes so the team can identify the appropriate support.

Why does packaging matter for RF performance?

The package, substrate, and interconnects form part of the RF signal path. Their geometry and materials can affect signal loss, impedance, isolation, and thermal behavior. Considering packaging alongside circuit design helps engineers address these factors before hardware is built.

Does NFR provide RF substrates and packaging services?

Yes. NFR provides PCB and substrate services, RF structure fabrication, and advanced assembly and packaging through its U.S.-based mOSAT operation. Available approaches include wire bonding, flip-chip assembly, and interposer-based integration, subject to project requirements.

Can NFR help with RF prototype bring-up and testing?

NFR supports prototype bring-up, characterization, and verification planning. The team works with you to define the measurements, operating conditions, and technical milestones appropriate for your hardware. Specific test capabilities and frequency coverage should be confirmed during project scoping.

What RF frequency ranges does NFR support?

Supported frequency ranges depend on the circuit, semiconductor technology, substrate, package, and required measurements. Share your operating band and bandwidth requirements with NFR so the team can confirm the appropriate design and test approach.