Explore technical feasibility and develop prototype hardware with NFR. We support projects involving challenging packaging, specialized interconnects, new sensing approaches, and high-performance analog and RF electronics.
From feasibility studies to prototype builds and characterization, our work helps teams evaluate an approach and develop a repeatable path for assembly.
![[background image] image of a workplace setting (for an ai healthcare company)](https://cdn.prod.website-files.com/6a6cf6716752c06a14b29875/6ad29e8b2cc72a0763a3d3f8_Rainbow%20Sensor%20Chip%20on%20Green%20Circuit%20Board.avif)
Our advanced technology work includes advanced chip packaging, multi-chip modules and system-in-package, chiplet integration, fine-feature substrates and interconnects, MEMS integration, novel sensors, unusual materials and fabrication processes, and high-frequency electronics.
The development approach is defined around the technology, its maturity, and the evidence needed to evaluate it.
![[background image] image of a workplace setting (for an ai healthcare company)](https://cdn.prod.website-files.com/6a6cf6716752c06a14b29875/6ad7d5f0600e10078fa0e8c3_Cleanroom%20Microassembly%20Technician%20at%20Work.avif)
LET’S WORK TOGETHER
NFR supports startups, manufacturers, semiconductor companies, and government research programs with hardware development and repeat builds for continued evaluation.Bring us your concept, integration challenge, or prototype goals. We’ll help determine what to design, build, and measure next.


NFR supports technical feasibility studies, design and simulation, prototype hardware, characterization, and assembly process development. Projects may involve advanced packaging, specialized interconnects, novel sensors, MEMS integration, and high-performance analog and RF electronics. The scope depends on the technology and the evidence needed to evaluate it.


Yes. Chiplet integration, multi-chip modules, and system-in-package are among NFR's areas of development. NFR helps investigate how multiple devices can work together within the project's physical and electrical constraints, using design, test structures, prototypes, and characterization as appropriate.

Deliverables can include feasibility studies, simulations, test structures, material samples, die, packages, substrates, working modules, and characterization data. Projects may also include assembly process development and pilot production within an agreed scope. Deliverables are defined around the next technical decision your team needs to make.



