ITAR Registered ∙ ISO 9001:2015 Certified

Capabilities
- Design
  ASIC & System Design
  Custom mixed-signal ASIC design backed by U.S.-based engineering expertise.
  PCB Design
  Complete schematic capture and PCB layout, backed by experienced engineering support.
  Packaging & Substrate Design
  Multi-layer substrates designed and manufactured in one place. 100% manufactured in the USA.
  OSAT
  Wafer Processing
  & Semiconductor Packaging
  Complete semiconductor assembly and packaging services, from precision wafer preparation and die placement to advanced interconnects, protective packaging, and final IC testing.
  Cleanroom
  & Wafer Processing
  Wafer dicing, bonding, bumping,metal depositions, and other specialized cleanroom services in one place.
  Engineering services
  Enterprise
  Engineering Services
  Flexible engineering teams that extend your technical capabilities.
  Phased Array Transceiver
  BeyRad
  Multi-beam steering. Aperture Sharing. Adaptive nulling.
  Manufacturing
  Order PCB
  Order Packaging
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