NoiseFigure Research (NFR) provides U.S.-based semiconductor engineering and manufacturing services, including custom ASIC design, PCB design and manufacturing, packaging, wafer dicing, cleanroom services, and testing. Customers can use a single service or engage NFR as an end-to-end development partner.
NFR combines semiconductor design, manufacturing, packaging, and testing capabilities under one organization. This integrated approach reduces handoffs, accelerates development, and helps identify manufacturing and integration challenges earlier. NFR is also known for responsive collaboration, flexible engagements, U.S.-based capabilities, and globally competitive pricing.
NFR reduces the complexity of managing separate design, PCB, packaging, cleanroom, and testing vendors. Our teams work together across disciplines, providing better continuity, faster communication, fewer handoffs, and earlier identification of potential problems. You can still use NFR for only the services you need.
Yes. NFR can support projects from early architecture and custom ASIC design through foundry coordination, wafer dicing, packaging, PCB manufacturing, testing, and production readiness. NFR can also integrate with your existing team and partners where needed.
No. NFR engagements are flexible. Use us for a single specialized service, to augment your engineering team, or as an end-to-end development partner.
Aerospace & Defense · Medical & Life Sciences · Industrial & Automation · AI & Intelligent Sensors · Communications & RF · Advanced Technology
As early as possible. Early involvement allows NFR to consider architecture, process technology, packaging, testing, manufacturability, cost, and production requirements before key design decisions are locked in.
Yes. Custom ASIC design is one of NFR's core capabilities, including analog, digital, mixed-signal, and RF IC design. Unlike a standalone ASIC design firm, NFR can also support packaging, PCBs, testing, and other downstream development needs.
NFR operates a U.S.-based wafer processing and semiconductor packaging services for programs that do not require the scale or volume of a traditional OSAT. NFR's OSAT capabilities include wire bonding, flip-chip, 2.5D integration, testing, and related packaging services
Yes. NFR's engineers can supplement your internal team with specialized ASIC, PCB, packaging, test, and semiconductor engineering expertise.
NoiseFigure Research is headquartered in Renton, WA, with U.S.-based engineering and manufacturing capabilities.
Yes. NFR is registered under the International Traffic in Arms Regulations (ITAR) with the U.S. Department of State's Directorate of Defense Trade Controls (DDTC). This allows NFR to support defense programs involving ITAR-controlled technical data and hardware. Details can be found here.
Yes. NFR is ISO 9001:2015 certified, reflecting established quality-management processes across its operations. Details can be found here.
Yes. NFR supports government, defense, aerospace, and other programs requiring secure U.S.-based semiconductor engineering and manufacturing capabilities. NFR's domestic capabilities and ITAR registration make it well-suited for programs with security, supply-chain, and technology-control requirements.
Yes. NFR works with customers internationally while providing engineering and manufacturing capabilities from the United States.
Yes. NFR is not tied to a single foundry, allowing our engineers to recommend process technologies and manufacturing partners based on the requirements of your application.
Yes. NFR supports prototypes, engineering builds, specialized low-volume programs, and the transition toward production.
NFR supports ASIC development from architecture through production, including analog, digital and mixed-signal design, verification, physical design, foundry coordination, packaging and test planning, bring-up, and validation. We can support the entire program or augment your team at a specific stage.
Yes. Mixed-signal integration is a core NFR capability, combining analog, digital, and, where required, RF functions within a custom IC.
Yes. NFR has experience with RF and microwave ICs as well as mixed-signal, analog, sensor interface, high-speed digital, and low-power designs.
NFR has experience across a broad range of technologies, from mature processes such as 180 nm through more advanced CMOS and SiGe technologies. Process selection depends on the application's performance, cost, availability, and production requirements.
No. NFR is foundry-agnostic. We help customers select an appropriate foundry and process based on the technical and commercial requirements of the program rather than steering projects toward a single manufacturing platform.
Yes, depending on the design stage and available design files. NFR can take on specific portions of an existing ASIC program, provide specialized engineering support, or help complete a design already in progress.
Yes. NFR can provide specialized engineering expertise and additional design capacity as an extension of an internal engineering organization, without requiring NFR to manage the entire program.
NFR considers packaging, testing, manufacturability, PCB integration, and production requirements throughout development rather than treating them only as post-tape-out activities. This manufacturing-first approach can identify integration issues earlier and reduce costly redesigns later.
Yes. NFR has developed a portfolio of proven internal IP blocks and architectures that can be leveraged where appropriate to reduce design time, development cost, and technical risk.
NFR can remain involved after tape-out, coordinating wafer fabrication and supporting wafer dicing, packaging, PCB design and manufacturing, device bring-up, testing, validation, and the transition toward production.
Yes. NFR can stay with a program from architecture and ASIC design through foundry coordination, packaging, test, PCB integration, bring-up, and production support. Keeping these stages connected helps identify downstream issues earlier and reduces handoffs between suppliers.
A custom ASIC becomes worth considering when an FPGA or COTS solution creates limitations in power, size, performance, integration, or unit cost. It can be particularly compelling when multiple functions can be consolidated into a single device or when production volumes justify the upfront development investment.
NFR manufactures 1-, 2-, 4-, and up to 8-layer PCBs for prototypes and low-to-medium-volume production, including boards for RF, high-speed digital, mixed-signal, and other demanding applications.
Standard fast-turn capabilities include approximately 2 business days for 2-layer boards and 3 business days for 4-layer boards. Single-layer bare boards can be manufactured the same day, and expedited turnaround may be available for other designs depending on requirements. Lead times for higher layer counts and specialized designs vary based on complexity and material requirements.
Yes. NFR's PCB manufacturing is U.S.-based, providing domestic production, responsive engineering support, and a more secure supply chain.
Yes. Rapid prototypes and low-to-medium-volume programs are a core part of NFR's PCB offering. This makes NFR particularly well suited to engineering development, research, qualification, and specialized production programs.
A list of PCB Materials can be found here.
Yes. NFR supports RF and microwave applications, including high-frequency materials, hybrid stack-ups, controlled impedance designs, and specialized RF structures.
Yes. NFR's broader experience in analog, mixed-signal, RF, and high-speed digital engineering provides additional expertise for boards with demanding signal-integrity and performance requirements.
Available finishes include ENIG, including Bondable Gold Plating, immersion tin, and bare copper. Other application-specific requirements can be discussed with the NFR manufacturing team.
Yes. Bondable Gold Plating is available for applications requiring wire bonding and integration with advanced semiconductor packaging.
Yes. Customers can work directly with experienced engineers to discuss manufacturability, materials, stack-up, and other technical considerations before production.
Yes. NFR manufactures PCBs and specialized substrates, including fine-pitch substrates supporting semiconductor packaging and integration applications.
Yes. Unlike a standalone PCB fabricator, NFR can also support ASIC development, wafer dicing, packaging, cleanroom processing, testing, bring-up, and production support.
Yes. NFR supports fine-feature substrates and specialized interconnect development for projects with demanding integration requirements. The work may include design, simulation, test structures, samples, and prototype builds to evaluate the proposed approach.
Yes. NFR's U.S.-based OSAT capabilities provide packaging, assembly, and testing, including wire bond, flip-chip, and 2.5D integration.
Large OSATs are generally optimized for high-volume semiconductor production. NFR's OSAT is designed for smaller, specialized programs that need greater flexibility, engineering collaboration, rapid turnaround, and lower-volume support.
NFR's wafer processing and semiconductor packaging services are particularly suited to organizations developing prototypes, custom ASICs, specialized semiconductor devices, research programs, and low-volume or emerging production programs that may not fit the business model of a large global OSAT.
NFR's capabilities include flip-chip assembly, wire bonding, die attach, C4 reflow, gold thermal compression bonding, underfill, BGA solder bump application, multi-module placement, gold stud bumping, and conventional packaging approaches such as QFN and lead-frame packaging.
Yes. NFR supports lead-frame, open-cavity, and chip-on-board wire bonding, conductive and non-conductive die attach, and ball, wedge, and ribbon bonding.
Yes. Flip-chip and C4 assembly are part of NFR's advanced packaging capabilities, along with underfill, bumping, and related integration processes.
Yes. NFR manufactures specialized substrates and interposers in-house. This can significantly reduce the substrate lead times that often delay prototype packaging programs.
Yes. NFR provides precision dicing for silicon, glass, and advanced substrates, including fast-turn prototyping and specialized processing for fragile materials.
Yes. We can support the path from fabricated wafer through dicing, packaging, substrate development, assembly, testing, PCB integration, bring-up, and production planning.
Yes. Supporting prototypes and smaller-volume programs is a core reason for NFR's OSAT model. Customers can access advanced packaging capabilities without requiring the production volumes typically associated with a large OSAT.
Yes. Because NFR's engineering capabilities span ASIC design, packaging, substrates, PCB integration, and testing, we can consider electrical, mechanical, thermal, manufacturing, and system requirements when developing a packaging approach.
Yes. NFR can support wafer processing and dicing, package and substrate development, assembly, PCB development, bring-up, validation, testing, and production support, providing continuity beyond tape-out.
Yes. NFR's wafer processing and semiconductor packaging services are U.S.-based and designed to provide responsive engineering collaboration, faster turnaround, and domestic supply-chain options for programs where those considerations matter.
NFR provides access to experienced engineering talent across semiconductor and electronic product development, including ASIC and system design, analog and mixed-signal engineering, RF and high-speed design, PCB and substrate design, verification, test, validation, and related development disciplines.
NFR can work alongside your engineers, take ownership of a defined workstream, or provide specialized expertise at a particular development stage. Engagements can be short-term or ongoing, depending on your technical needs, schedule, and internal resources.
Yes. NFR can join a program at virtually any stage, from early architecture and design through verification, prototyping, testing, packaging, and production support. You do not need to engage NFR for an entire development program.
Yes. In addition to augmenting internal teams, NFR can manage defined projects or larger development programs. The scope can be tailored around specific deliverables, milestones, technical requirements, and your internal resources.
NFR is an engineering organization, not a staffing company. Our engineers are supported by broader semiconductor development capabilities and can draw on expertise across ASIC design, PCB design and manufacturing, packaging, test, validation, and production when a project requires it.
Yes. Engineering services can be used to fill specific technical gaps without requiring you to build permanent internal capability. This can be particularly useful for specialized design disciplines, short-term development needs, or programs that require expertise outside your team's core competencies.
Yes. NFR supports ASIC and system design, PCB design and manufacturing, packaging, assembly, and test. Our engineers can address specific integration challenges, such as ASIC-to-PCB interfaces, package and substrate requirements, board bring-up, and device validation. You can engage us for individual disciplines or coordinate multiple stages through one team.
NFR provides U.S.-based engineering and manufacturing capabilities and is ITAR registered. Contact NFR to discuss the specific security, compliance, personnel, or program requirements associated with your project.
Project IP, confidentiality, data access, and ownership requirements are defined as part of each engagement. NFR can work within customer-specific confidentiality and information-handling requirements appropriate to the program.
A good starting point is a discussion of your technical objectives, current development stage, schedule, internal resources, and where you need additional expertise or capacity. From there, NFR can help define an appropriate scope and engagement model. Talk With Our Engineering Team
Yes. NFR’s engineering services can be engaged independently of its manufacturing capabilities. You can use NFR for a specific engineering discipline, project phase, or team augmentation need without committing to downstream manufacturing. When manufacturing, packaging, or test support is needed, those capabilities can also be brought into the program.
