ITAR Registered ∙ ISO 9001:2015 Certified
Capabilities
Design
ASIC & System Design
Custom mixed-signal ASIC design backed by U.S.-based engineering expertise.
PCB Design
Complete schematic capture and PCB layout, backed by experienced engineering support.
Packaging & Substrate Design
Multi-layer substrates designed and manufactured in one place. 100% manufactured in the USA.
OSAT
Wafer Processing
& Semiconductor Packaging
Complete semiconductor assembly and packaging services, from precision wafer preparation and die placement to advanced interconnects, protective packaging, and final IC testing.
Cleanroom
& Wafer Processing
Wafer dicing, bonding, bumping,metal depositions, and other specialized cleanroom services in one place.
Engineering services
Enterprise
Engineering Services
Flexible engineering teams that extend your technical capabilities.
Phased Array Transceiver
BeyRad
Multi-beam steering. Aperture Sharing. Adaptive nulling.
Manufacturing
Order PCB
Order Packaging
About
Our Company
Who We Work With
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Advanced Technologies
AI & Sensors
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Design to Product
Who We Work With
