mOSAT Orders
Semiconductor Package Ordering
Use the simple workspace order-prep tool to order and design your package: upload a die and substrate image, drop it into the canvas, and click-drag it into the desired position, add the desired bond wires, and send it for a quote.
Build Your Package
Set Up the Workspace
Upload a landing substrate and a die separately, then position them inside the workspace before connecting them with bond wires.
Assigned order number
Use this number when saving or requesting a quote.
Generating...
Waiting for die and substrate uploads
- Upload a substrate and die, then click the image on the canvas to select it.
- The die always stays above the landing substrate.
- Use Setup Substrate Positions to return to die/substrate selection and editing.
- Selected images are highlighted so you can move, resize, or trim the active layer.
- Use the package design tools to add bond wires, dicing lines, or bumps and balls onto the workspace.
- Use Delete Selected or the Delete key to remove the selected picture, selected line, or selected bump.
- Use the PHP page to save, recall, and quote package layouts after the workspace is prepared.
Arrange your die, substrate, interconnects, and bumps here so our team can quickly understand the package concept you want quoted or reviewed.
Properties
Click a die or substrate image to move it, drag bond wire endpoints to refine the routing, and select bumps or lines whenever you need to reposition or delete them.
Zoom: 100%