ASIC Solutions Overview
From architecture and mixed-signal integration to manufacturable implementation, we help turn complex ASIC ideas into reliable product-ready silicon.
Why Should You Consider working with NFR to build your Integrated Solutions (IC)?
When you partner with us you will gain access to ASIC design services, cutting-edge IC expertise, streamlined processes, and a seamless integration of design, clean room services, and substrate manufacturing—all under one roof. We turn complex ideas into efficient, high-performance solutions, saving you time and maximizing innovation.
NFR has been in the ASIC business for over a decade and a half and has provided large and small companies with hundreds of custom IC designs from low-end 0.5um nodes to complex mixed-signal ICs with large digital IP and customized cores. We have seen the ups and downs of the market and can correctly guide you to the right technology to reliably deliver to your target application and market.
How we bridge your needs to ASIC
NFR has developed a very simple and systematic approach to getting to your IC solution. Please continue reading below for our 3-step solution.
STEP 1 Your Project Goal
Whether you have your system sketched on a piece of paper or a fully designed schematic, NFR will be able to jump right in and guide you to the first draft of your integrated solution. We begin by defining core functionalities and finding out if you actually need an ASIC or if we can find an already existing solution via our partners and suppliers. Our goal in this first phase is to make sure you get your solution as soon as possible and confirm whether a new IC is absolutely necessary.
STEP 2 Your Integrated Circuit (IC) Solution Specifications
Once we identify your needs and target product, we begin generating the specifications for your Integrated Solutions. We start by creating a target solution sheet and performing all necessary system analysis to ensure that our specifications will deliver the required performance. Leveraging our wide range of services, we can either immediately design or redesign and onboard (PCB) systems to demonstrate functionality prior to integration, helping to reduce risk and increase accuracy in achieving your desired performance. After finalizing the first-level specifications, our team will schedule a sign-off meeting with you to move forward with the next phase of planning, including timelines and the first deliverables
STEP 3 Timelines and Deliverables
During the timelines and first deliverables phase, we define the following key elements: the required articles, your desired timelines, and target production. These three factors are crucial for establishing a clear path to meet performance metrics, pricing targets, and time-to-market goals. For example, performance metrics may include desired power consumption, a time metric could be the availability of first selections by a specific date, and time-to-market could involve the availability of production wafers by the required deadlines. We will prepare these details for your team to provide a clear view of your product roadmap and design
