mOSAT Solutions Overview
We support advanced assembly, packaging, and post-fabrication integration paths that help move silicon into robust, manufacturable system-level solutions.
NFR is redefining Outsourced Semiconductor Assembly and Test (OSAT)
Our U.S.-based mini OSAT provides advanced packaging and test services designed to meet today's most demanding semiconductor needs. We specialize in fine-pitch substrates, multi-layer PCB/packaging trials, and advanced interconnect technologies including flip chip, wire bond, and 2.5D integration. With local engineering support and rapid prototyping capabilities, we enable faster design cycles, reduced logistics complexity, and greater supply chain security. By combining flexibility with cutting-edge assembly and test expertise, our mini OSAT empowers customers to bring innovative products to market with speed, precision, and reliability.
NFR has expanded its expertise into the OSAT space with the launch of our U.S.-based mini OSAT (mOSAT) operations. Over the years, we have supported companies of all sizes with advanced packaging and substrate solutions, ranging from standard wire-bond packages to complex multi-layer, fine-pitch designs with flip-chip and stacked integration. Having witnessed the evolving demands of the semiconductor supply chain, we are well-positioned to guide you toward the right packaging and test technologies to ensure reliable delivery for your target applications and markets
Our Products
Quickly see where NFR fits in your package build, interconnect, and test flow.
These service blocks are organized so customers can immediately understand the type of support available, the scale of the work, and the path to start a technical conversation.
Advanced Packaging
Flip-chip, 2.5D interposers, fine-pitch assembly, and high-density routing for performance, density, and compact system integration.
- Multi-module placement for complex assemblies
- C4 reflow with leaded or unleaded assembly options
- Au thermal compression bonding and underfill support
- BGA solder bump application and selective bump removal
- Alignment accuracy: 10 µm
- Typical package support: QFN, leadframe, and related approaches
Substrates & Interposers
Multi-layer organic substrates, fine lines and spacing, and build-up structures for compact high-I/O platforms.
- Line/space: 2 mil / 2 mil, about 50 µm / 50 µm
- Layers: 2
- Max size: 12.5 mm × 12.5 mm
- BGA: 0.5 mm ball, about 144 balls
- Material: ISOLA HR370, 10 mil
- Turnaround: 2 to 5 business days
Wire Bond Packages
Cost-effective QFN, QFP, open-cavity, and custom leadframe solutions with reliable Au, Al, and Cu bonding flows.
- Leadframe wirebonding and open-cavity assembly
- Chip-on-board wirebonding for fast prototyping paths
- Die attach options: conductive and non-conductive
- Bond pad size: down to 40 µm
- Bonding types: ball, wedge, and ribbon
- Gold stud bumping available
RF Structures
Micron-level RF structure fabrication for rapid prototyping, dual-layer interposers, and tightly controlled geometry work.
- Line/space: 3 mil
- Layers: 2, with grounded bottom layer
- Max size: 12.5 mm × 12.5 mm
- Substrate: Astra MT77, 2.5 mil
- Copper thickness: about 18 µm
- Turnaround: about 3 business days with optional modeling
Dicing Services
High-precision wafer dicing with narrow kerf capability for silicon, glass, and advanced substrate programs.
- Wafer types: silicon, glass, and advanced substrates
- Cut accuracy: ±5 µm
- Kerf width: down to 60 µm
- Wafer thickness: 50 µm to 1 mm
- Die size: as small as 250 µm × 250 µm
- Chipping control: optimized for fragile materials and fast prototyping
Full Service
From first concept through validation, NFR can support the complete path with packaging, bring-up, and verification assistance.
- End-to-end support from design handoff through packaged hardware
- Bring-up and characterization aligned to technical milestones
- Burn-in and verification planning for accelerated evaluation
- Optional modeling and stress testing when projects require deeper coverage
- Single-team coordination to reduce handoff friction
mOSAT by NFR
Agile. Local. Advanced. Redefining semiconductor packaging and test, closer to where innovation happens.
1 Capital cost avoidance
Building and maintaining in-house assembly and test facilities is extremely expensive. mOSATs already have the infrastructure, saving your company from heavy capital expenditures or overseas expensive engagements to reach your semiconductor packaging and prototyping needs
2 Scalability & flexibility
NFR mOSAT concept allows your company to ramp up or scale down production quickly without needing to re-size your facility. We can support a decent volume to get you close or at production level.
3Specialized Expertise
NFR's mOSAT has invested in advanced packaging, test capabilities, and new technologies (e.g., flip chip, fan-out wafer level packaging, 2.5D/3D integration) so that you don't have to. Our customers can leverage this know-how instead of developing it internally.
4Speed to Market
NFR's mOSAT established processes can accelerate your time-to-market by handling assembly and testing in parallel with design and fabrication. NFR offers our customers a unique combination of system, ASIC, and Substrate design not before seen in any industry.
5Geographic Reach & Supply Chain Benefits
NFR's mOSAT unlike large offshore providers, has a focused approach allowing us to deliver highly customized solutions, rapid prototyping, and agile support at financially efficient levels locally.
